By John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing. (eds.)
While tin/lead solders have ruled the electronics for a few years, environmental issues and new laws are forcing switch. sponsored by way of greater than ten years of study in Pb-free solders, many electronics brands are poised for conversion.
A advisor to Lead-free Solders is meant as a device to assist because it strikes right into a new period within the creation and use of solders. an summary of the rules of soldering expertise is equipped starting with the speculation underlying every one idea. concentrating on the main updated tools for checking out and characterization, those theories are then bolstered via experimental examples and business applications.
• Addresses key matters in meeting from a fabrics aspect of view.
• provides the reader handy entry to information crucial for the correct evaluate and employment of state-of-the-art ternary Sn/Ag/X solders
• permits comparability of the functionality of Pb-free solders with that of ordinary eutectic SnPb.
Although basically of curiosity to specialist layout and reliability engineers operating in electronics meeting and production, A advisor to Lead-free Solders can be beneficial for graduate scholars trying to follow services in fabrics, mechanical or digital engineering during this undefined. Researchers in electronics and fabrics will locate the most recent examine at their fingertips including the most likely instructions will want from such examine within the future.
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Additional info for A Guide to Lead-free Solders: Physical Metallurgy and Reliability
O. and Stephens, R. , (1980), Metal Fatigue in Engineering, John Wiley and Sons, New York, pp. 7881, pp 182184. , (May 2002) A European Perspective from a Global OEM, (May 2002) IPC/Jedec Conference on Lead Free Electronic Components and Assemeblies, San Jose, CA. , (May 2002) First US Product Manufactured with Lead-Free Solder Paste: How We Did It, IPC/Jedec Conference on Lead Free Electronic Components and Assemeblies, San Jose, CA. , Ooki, K. ; Res. , Yokohama; Electronics and the Environment, 1999.
R. (1999), “Materials Issues in Area-Array Microelectromic Packaging”, JOM, Vol. 51, No. 3, pp. 2227, 1999. Gaylon, G. (2003), “Annotated Tin Whisker Bibliography”, NEMI Monograph, July 2003. , and Westby, G.
Direct consideration of the strain energy density, extracted from estimates of the hysteresis loop, provides for directly accounting for the monotonic behavior and the effects of creep and stress relaxation at a given cyclic condition. 5 Creep and Stress Relaxation 23 Here, failure conditions must be defined and then the coefficient \o and exponent k can be determined for a specific alloy from test data and hysteresis loop estimates. In the development of his variation of the CoffinManson equation from Wild’s data, Engelmaier noted a change in the trend in cyclic behavior within the range of 0 to 20°C for near-eutectic SnPb solders.