By Shantanu Nakhate
Strength MOSFETs know-how has grown exponentially over final 5 years. this day you have got many FET units to choose between to your switching functions. during this ebook i've got inquisitive about uncomplicated figuring out of energy MOSFETs, easy methods to learn their datasheets, picking out FETs to your program, the place to discover info on web and all you should learn about FETs.
Motivation for scripting this e-book comes from my event with reference to choosing right FETs for energy digital program and the way advanced this likely sure bet has develop into. The booklet is written for newbie engineers who are looking to research from scratch approximately strength FETs and in addition for specialists to discover required info speedier. specialists might locate this e-book nearly as good reference.
the 1st bankruptcy introduces the ability FET as a switching gadget and the potential switching area within which it will probably be utilized. In moment bankruptcy the meanings of other terminologies used to explain the gadget are defined. The 3rd bankruptcy explains the way to learn the datasheet of the MOSFET. The fourth bankruptcy offers record of MOSFET brands and the net hyperlinks of a similar. The 5th bankruptcy provides the hyperlinks to literature to be had on the net approximately FETs. The 6th bankruptcy supplies an set of rules to pick acceptable FET to your software. The 7th bankruptcy briefs approximately gate drivers used to change the FETs and in addition provides web hyperlinks to the datasheets of an identical.
Appendix A supplies web hyperlinks of the prospective on-line owners from whom you should buy the FETs. Appendix B supplies web hyperlinks the place the package deal info for the FETs are available. Appendix C explains checking out of the FET.
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Extra info for Power MOSFETs
Example text
Figure 15 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems, but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows STEP 1 PREHEAT ZONE 1 “RAMP” 200°C STEP 2 STEP 3 VENT HEATING “SOAK” ZONES 2 & 5 “RAMP” DESIRED CURVE FOR HIGH MASS ASSEMBLIES STEP 4 HEATING ZONES 3 & 6 “SOAK” 160°C STEP 5 STEP 6 STEP 7 HEATING VENT COOLING ZONES 4 & 7 205° TO 219°C “SPIKE” PEAK AT 170°C SOLDER JOINT 150°C 150°C 100°C 140°C 100°C SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES 5°C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 15.
3 TJ, JUNCTION TEMPERATURE (°C) –VSD, SOURCE–TO–DRAIN VOLTAGE (VOLTS) Figure 9. Gate Threshold Voltage Variation with Temperature Figure 10. Diode Forward Voltage vs.
On–Resistance Variation with Temperature Figure 6. Drain–to–Source Leakage Current vs. com 31 30 NTD20N03L27 VGS, GATE–TO–SOURCE VOLTAGE (V) 2500 C, CAPACITANCE (pF) VGS – VDS 200 1500 Ciss 1000 Coss 500 Crss 0 10 8 6 4 2 0 2 4 6 8 10 12 14 16 18 20 23 25 Q 10 8 VGS 6 Q1 4 Q2 2 0 ID = 20 A TJ = 25°C 0 2 4 6 8 10 12 GATE–TO–SOURCE OR DRAIN–TO–SOURCE VOLTAGE (V) Qg, TOTAL GATE CHARGE (nC) Figure 7. Capacitance Variation Figure 8. Gate–to–Source and Drain–to–Source Voltage vs. 9 RG, GATE RESISTANCE (Ω) VSD, SOURCE–TO–DRAIN VOLTAGE (V) Figure 9.