By Stephen Desberg, Enrico Marini
Los angeles fumée blanche confirmant l'élection d'un nouveau pape s'est élevée au-dessus du Vatican. Mais, n'est-ce pas le démon qui vient de ceindre los angeles tiare pontificale ? Sur los angeles foi d'un signe merveilleux, le sombre cardinal Trebaldi s'est fait élire à l. a. succession de saint Pierre...
Un miracle aurait fait apparaître los angeles croix de saint Pierre au coeur de los angeles ville éternelle, dans les entrailles mêmes du palais ancestral des Trebaldi ! Chercheur réputé de reliques lucratives, le Scorpion a suffisamment décortiqué les textes anciens et fouillé les sous-sols de Rome pour avoir des doutes sur l'authenticité de cette miraculeuse et très opportune apparition. Il est vrai que l. a. culture de l'Eglise situe le martyre de l'Apôtre à Rome.
Un des rares cardinaux à encore oser s'opposer à l'orgueilleux Trebaldi cost le Scorpion de retrouver los angeles vraie croix, seul moyen de dénoncer l'illégitimité du nouveau souverain pontife. Pour mener à bien cette difficile venture, il lui faut échapper à l. a. vigilance des moines guerriers à los angeles solde de Trebaldi. Il lui faut en outre prendre l. a. course d'Istanbul et se lancer à los angeles découverte d'un goé castle mystérieux.
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Extra info for Le Scorpion, tome 4 : Le Démon au Vatican
Example text
Figure 15 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems, but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows STEP 1 PREHEAT ZONE 1 “RAMP” 200°C STEP 2 STEP 3 VENT HEATING “SOAK” ZONES 2 & 5 “RAMP” DESIRED CURVE FOR HIGH MASS ASSEMBLIES STEP 4 HEATING ZONES 3 & 6 “SOAK” 160°C STEP 5 STEP 6 STEP 7 HEATING VENT COOLING ZONES 4 & 7 205° TO 219°C “SPIKE” PEAK AT 170°C SOLDER JOINT 150°C 150°C 100°C 140°C 100°C SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES 5°C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 15.
3 TJ, JUNCTION TEMPERATURE (°C) –VSD, SOURCE–TO–DRAIN VOLTAGE (VOLTS) Figure 9. Gate Threshold Voltage Variation with Temperature Figure 10. Diode Forward Voltage vs.
On–Resistance Variation with Temperature Figure 6. Drain–to–Source Leakage Current vs. com 31 30 NTD20N03L27 VGS, GATE–TO–SOURCE VOLTAGE (V) 2500 C, CAPACITANCE (pF) VGS – VDS 200 1500 Ciss 1000 Coss 500 Crss 0 10 8 6 4 2 0 2 4 6 8 10 12 14 16 18 20 23 25 Q 10 8 VGS 6 Q1 4 Q2 2 0 ID = 20 A TJ = 25°C 0 2 4 6 8 10 12 GATE–TO–SOURCE OR DRAIN–TO–SOURCE VOLTAGE (V) Qg, TOTAL GATE CHARGE (nC) Figure 7. Capacitance Variation Figure 8. Gate–to–Source and Drain–to–Source Voltage vs. 9 RG, GATE RESISTANCE (Ω) VSD, SOURCE–TO–DRAIN VOLTAGE (V) Figure 9.